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Volumn 423-425, Issue , 2003, Pages 665-670
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Transient and residual stresses in a hollow cylinder of functionally graded materials
a
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Author keywords
Residual stress; Thermal shock; Thermal stress
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Indexed keywords
CERAMIC MATRIX COMPOSITES;
CERMETS;
ELASTIC MODULI;
MATHEMATICAL MODELS;
MICROSTRUCTURE;
ONE DIMENSIONAL;
RESIDUAL STRESSES;
THERMAL CONDUCTIVITY OF SOLIDS;
THERMAL EXPANSION;
THERMAL STRESS;
THERMAL EXPANSION COEFFICIENT;
THERMAL SHOCK;
TRANSIENT STRESS;
YOUNG MODULUS GRADIENT;
FUNCTIONALLY GRADED MATERIALS;
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EID: 0038715638
PISSN: 02555476
EISSN: 16629752
Source Type: Book Series
DOI: 10.4028/www.scientific.net/msf.423-425.665 Document Type: Conference Paper |
Times cited : (6)
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References (10)
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