Combinatorial approach to the edge delamination test for thin film reliability - Concept and simulation

Thin Solid Films

Volumn 437, Issue 1-2, 2003, Pages 197-203

  Chiang, Martin Y M ^a   Wu, Wen Li ^a   He, Jianmei ^a   Amis, Eric J ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Adhesion; Coatings; Combinatorial approach; Edge delamination; Finite element; Fracture mechanics; Interfacial debonding; Thin film

Indexed keywords

ADHESION; COMBINATORIAL MATHEMATICS; COMPUTER SIMULATION; DEBONDING; DELAMINATION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; THICKNESS CONTROL;

FILM THICKNESS;

THIN FILMS;

EID: 0038711287     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)00585-6     Document Type: Article

References (19)

1. Mittal K.L. Pure Appl. Chem. 52:1980;1295.
2. Mittal K.L. J. Adhes. Sci. Technol. 1:1987;247.
3. Buchwalter L.P. J. Adhes. 72:2000;269.
4. Zhao J.C. Adv. Eng. Mater. 3:2001;143.
5. Amis E.J., Sehgal A., Meredith J.C., Karim A. Abstracts of Papers of the American Chemical Society 221:70-BTEC, Part 2. 2001.
6. Amis E.J. Abstracts of Papers of the American Chemical Society 222:339-Poly, Part 2. 2001.
7. Crosby A.J., Karim A., Amis E.J. Am. Chem. Soc. Polym. Prepr. 42:2001;645.
8. Farris R.J., Bauer C.L. J. Adhes. 26:1988;293.
9. Shaffer E.O., McGarry F.J., Hoang L. Polym. Eng. Sci. 36:1996;2375.
10. Bogy D.B. J. Appl. Mech. 35:1968;460.
11. Pipes R.B., Pagano N.J. J. Compos. Mater. 4:1970;538.
12. Ting T.C.T., Chou S.C. Int. J. Solids Struct. 17:1981;1057.
13. Stolarski H.K., Chiang M.Y.M. Int. J. Solids Struct. 25:1989;75.
14. Ting T.C.T. Anisotropic Elasticity - Theory and Applications. 1996;Oxford University Press, Oxford.
15. Chiang M.Y.M., Chiang C.K., Wu W.L. J. Eng. Mater. Technol. Trans. ASME. 124:2002;274.
16. Finite Element Analysis Code and Theory (Standard and CAE), Version 6.2. 2000;Hibbitt, Karlsson and Sorensen, Inc, RI, USA, Certain commercial computer codes are identified in this paper in order to specify adequately the analysis procedure. In no case does such identification imply recommendation or endorsement by the National Institute of Standards and Technology (NIST) nor does it imply that they are necessarily the best available for the purpose.
17. Chiang M.Y.M., Chai H. Int. J. Solids Struct. 31:1994;2477.
18. Thouless M.D., Cao H.C., Mataga P.A. J. Mater. Sci. 24:1989;1406.
19. Stoney G.G. Proc. R. Soc. Lond. Ser. A. 82:1909;172.