Experimental study of solder joint reliability in a 256 pin, 0.4 mm pitch PQFP

Journal of Electronics Manufacturing

Volumn 6, Issue 2, 1996, Pages 67-78

  Yeo, C K ^a   Mhaisalkar, S ^a   Pang, H L J ^b   Yeo, A ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c NatSteel Electronics Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346446664     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313196000287     Document Type: Article

References (8)

1. J. S. Hwang, Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Van Nostrand Reinhold, New York, 1992, pp. 59-120.
2. C. K. Yeo and C. M. Loh, "Solder Joint Strength Assessment of QFPs", Gintic Internal Report, 93-1-006-MT-E, Aug. 1993.
3. K. M. Chua, "Solder Joint Strength Assessment of QFPs", Gintic Internal Report, GIMT-M-S94-015, May 1994.
4. A. Fukuda, "Micro Soldering Process for Fine Pitch Package", Proc. Nepcon West, 1993, pp. 1159-1168.
5. D. S. Dunn, T. F. Marinis, W. M. Sherry and C. J. Williams, "Dependence of Cu/Sn and Cu/60Sn40Pb Solder Joint Strength on Controlled Growth of Cu3Sn and Cu6Sn5." Materials Res. Soc. Proc. 40 (1985) 129-138.
6. L. G. Johnson, "The Median Ranks of Sample values in Their Population with an Application to Certain Fatigue Studies", Industrial Mathematics 2 (1951) 1-9.
7. R. Gerke, "Ceramic Solder Grid Array Interconnection Reliability", Proc. Nepcon West, Anaheim, C.A. 1994, pp. 1087.
8. R. Darveaux, K. Banerji, A. Mawer and G. Dody, "Reliability of PBGA Assembly", ed. John Lau, BGA Technology, McGraw Hill, NY, 1995, pp. 437.