Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assemblies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 589-596

  Vandevelde, B ^a   Gonzalez, M ^a   Beyne, E ^a   Zhang, G Q ^b   Caers, J ^b  

^a IMEC   (Belgium)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRON DEVICE TESTING; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FRACTURE; MICROSTRUCTURE; OPTIMIZATION; RELIABILITY; SOLDERED JOINTS; STRAIN;

CERAMIC BALL GRID ARRAYS; DAMAGE VOLUMES; ELECTRONCI PACKAGE ASSEMBLIES; POLYMER STUD GID ARRAY; QUAD FLAT PACKAGE; SOLDER JOINT RELIABILITY;

CHIP SCALE PACKAGES;

EID: 0038689237     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. R. Darveaux, "Constitutive Relations for Tin Based Solder Joints", IEEE Trans-CHMT, pp. 284-290, Vol. 11, 1988.
2. B. Vandevelde, E. Beyne, Solder parameter Sensitivity for CSP Life-Time Prediction using Simulation-Based Optimisation method, Proceedings of the 51st Electronic Components and Technology Conference, pp. 281-287, Lake Buena Vista, Florida, USA, 29 May - 1 June 2001.
3. http://www.marc.com
4. X. Baraton, K. Guttmann, B. Roesner, Thermal fatigue of solder flip-chip assemblies, pp 191-196, 11th European Microelectronics Conference, Venice, Italy, May 1997.
5. Kazuhide Doi, Prediction of thermal fatigue life for encapsulated flip chip interconnection, ISHM.
6. E. Beyne, F. Christiaens, B. Vandevelde, J. Roggen, J. Van Puymbroeck, L. Boone, M. Heerman, The Polymer Stud Grid Array package, Proceedings 1996 IEPS conference, Austin, USA, 1996.
7. B. Vandevelde, D. Degryse, E. Beyne, E. Roose, D. Corlatan, G. Swaelen, G. Willems, F. Christiaens, D. Vandepitte and M. Baelmans, Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages, Elsevier's journal on Microelectronics Reliability, Volume 43, Issue 2, Pages 307-318, Febr. 2003.
8. B. Vandevelde, E. Driessens, A. Chandrasekhar, E. Beyne, J. Van Puymbroeck, M. Heerman, "Characterisation of the Polymer Stud Grid Array (PSGA), A lead-free CSP for High Performance & High Reliable Packaging", Proceedings of SMTA conference, pp. 431-438, 30 September - 4 October 2001, Chicago, Illinois, USA.