Low-noise monolithic oscillator with an integrated three-dimensional inductor

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn , Issue , 2003, Pages

  Van Schuylenbergh, Koenraad ^a   Griffiths, Bernie ^b   Chua, Christopher L ^a   Fork, David K ^a   Lu, Jeng Ping ^a  

^a PALO ALTO RESEARCH CENTER   (United States)

^b Mixed Signal Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN FOR TESTABILITY; EDDY CURRENT TESTING; ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; INTEGRATING CIRCUITS; MAGNETIC FIELD EFFECTS; MONOLITHIC INTEGRATED CIRCUITS; RESONANT CIRCUITS; SEMICONDUCTOR DEVICE MANUFACTURE; SKIN EFFECT; THIN FILM DEVICES; VARIABLE FREQUENCY OSCILLATORS;

INTEGRATED THREE DIMENSIONAL INDUCTOR; LOW NOISE MONOLITHIC OSCILLATOR; ON CHIP PLANAR INDUCTORS; OUT OF PLANE COILS; THIN MOLYBDENUM CHROMIUM FILMS;

SOLID STATE OSCILLATORS;

EID: 0038645208     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Young D.J., V. Malba, J.J. Ou, A.F. Bemhardt and B. E. Boser, "Monolithic high-performance three-dimensional coil inductors for wireless communication applications," IEDM Dig. Tech. Papers, pp. 67-70, Dec. 1997.
2. Yue C.P. and S.S. Wong, "On-chip spiral inductors with patterned ground shields for Si-based RF IC's," IEEE J. Solid-State Circ., vol. 33, no. 5, pp. 743-752, 1998.
3. Smith D.L. and A.S. Alimonda, "A new flip-chip technology for high-density packaging," Proc. 46th ECTC, May 28-31, 1996, Orlando, FL, USA, pp. 1069-1073, 1996.
4. Chua, C.L., D.K. Fork, K. Van Schuylenbergh, and J.-P. Lu, "Self-assembled out-of-plane high Q inductors," Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head Island, SC, USA, June 2-6, 2002, pp. 372-373.