Temperature effects on microstructural evolution and resulting surface mechanical properties of Ni-based MEMS structures

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4980, Issue , 2003, Pages 192-199

  Lian, Kun ^a   Jiang, J C ^b   Ling, Z G ^a   Meletis, E I ^b  

^a LOUISIANA STATE UNIVERSITY   (United States)

^b Louisiana State University   (United States)

Author keywords

Electroplated Ni; LIGA Ni; Microstructures; Nanocrystalline Ni; Nanohardness; Thermal stability

Indexed keywords

ELECTROPLATING; HARDNESS; METALLOGRAPHIC MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; SCANNING ELECTRON MICROSCOPY; STRENGTH OF MATERIALS; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY;

NANOHARDNESS;

MICROELECTROMECHANICAL DEVICES;

EID: 0038397350     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.478193     Document Type: Conference Paper

References (11)

1. K. Lian, J.C. Jiang, D. Guidry and E.I. Meletis. "Nano Structure Evolution of Electroplated Nickel and Its Surface Mechanical Properties," NanoSpace2001, Galveston, TX, March 2001.
2. K. Lian, Z. Ling, J. Gotter, G. Ding, J. Jiang and E.I. Meletis, "Microstructure Evolution and Surface Mechanical Properties of Electroplated Nickel as a Function of Processing Parameters," HARMST 2001, June, p. 213, 2001. Germany.
3. Last, H.R.; Hemker, K.J. and Witt, R.; "MEMS material microstructure and elastic property modeling," MRS Symposium Proc. 605, pp.191-196, 2000.
4. Christenson, T.R.; Buchheit, T.E. and Schmale, D.T.; "Torsion testing of diffusion bonded LIGA formed nickel," MRS Symposium Proc. 546, pp. 127-132, 1999.
5. Sharpe, W. N., Jr., LaVan, D. A. and Edwards R. L., "Mechanical Properties of LIGA-Deposited Nickel for MEMS Transducers", Proceedings Transducers '97, Chicago, 2, pp. 607-610, 1997(2).
6. H.S. Cho, W.G. Babcock, H. Last and K.J. Hemker, "Tensile Properties of LIGA Ni Structures for a Safety and Arming Device," HARMST 2001, June, p. 201-201. 2001. Germany.
7. T.R. Christenson, T.E. Buchheit, D.T. Schmale and R.J. Bourcier, MRS. Proc. 518. p. 185-190, 1998.
8. Z.L. Xie, D. Pan, H. Last and K.J. Hemker, MRS Proc., 605. p.197-202, 1999.
9. H.S. CHo, W.G. Babcock, H. Last and K.J. Hermker, "Temperature Dependence of the Microstructure and Mechanical Properties of LIGA Nickel for MEMS," MRS. Proc. (2000).
10. H. Gleiter, Progr. Mater. Sci. 33, 223- (1989).
11. M.C. Iordache, S.H. Whang, Z. Jiao and Z.M. Wang "Grain Growth Kinetics in Nanostructured Nickel," NanoStructured Materials, Vol.11, No.8, pp.1343-1349, 1999.