Thick polycrystalline silicon for surface-micromechanical applications: Deposition, structuring and mechanical characterization

Sensors and Actuators, A: Physical

Volumn 54, Issue 1-3, 1996, Pages 674-678

  Lange, Peter ^a   Kirsten, Mario ^a   Riethmüller, Werner ^a   Wenk, Beatrice ^a   Zwicker, Gerfried ^a   Morante, J R ^b   Ericson, Fredric ^c   Schweitz, Jan Åke ^c  

^a FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

^b UNIVERSITY OF BARCELONA   (Spain)

^c UPPSALA UNIVERSITY   (Sweden)

Author keywords

Polysilicon; Surface micromachining

Indexed keywords

EID: 0038386523     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)80036-2     Document Type: Article

References (8)

1. R.T. Howe and R.S. Muller, Polycrystalline and amorphous silicon micromechanical beams: annealing and mechanical properties, Sensors and Actuators, 4 (1983) 447.
2. T.A. Core, W.K. Tsang and S.J. Sherman, Fabrication technology for an integrated surface micromachined sensor, Solid State Technol., (October) (1993) 39.
3. C.A. Bang, J.M. Melzag and M. Mehregany, From microchips to MEMS, Microlithography World, (Spring) (1994) 15.
4. M. Kirsten, B. Wenk, F. Ericson, J.Å. Schweitz, W. Riethmüller and P. Lange, Deposition of thick doped polysilicon films with low stress in an epitaxial reactor for surface micromachining applications, Thin Solid Films, 259 (1995) 181.
5. F. Ericson, S. Greek, J. Söderquist and J.Å. Schweitz, High sensitive internal film stress measurement by an improved micromachined indicator structure, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators (Transducers'95)/Eurosensors IX, Stockholm, Sweden, 25-29 June, 1995, Vol. 2, pp. 84-87.
6. S. Greek, F. Ericson, F. Johansson and J.Å. Schweitz, In situ tensile strength measurements of thick film and thin film micromachined structures, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators (Transducers'95)/Eurosensors IX, Stockholm, Sweden, 25-29 June, 1995, Vol. 2, pp. 54-59.
7. J. Huang, P. Krulevich, G.C. Johnson, R.T. Howe and H.R. Wenk, Investigation of texture and stress in undoped polysilicon films, Mater. Res. Soc. Proc., 182 (1990) 201.
8. P. Joubert, B. Loisel, Y. Chouan and L. Haji, The effect of low pressure on the structure of LPCVD polycrystalline silicon films, J. Electrochem. Soc., 134 (1987) 2541.