Cost-effectiveness and environmental aspects of flip chip bumping for system integration

Microsystem Technologies

Volumn 9, Issue 5, 2003, Pages 324-330

  Schischke, K ^a   Griese, H ^b   Muller J ^b   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COST EFFECTIVENESS; ECOLOGY; ECONOMICS; ELECTROPLATING; ENVIRONMENTAL IMPACT; LIFE CYCLE; MICROELECTRONICS; OPTIMIZATION;

ECO-ANALYSIS; FLIP CHIP BIMPING; INTERCONNECTION DENSITIES; SYSTEM INTEGRATION; WAFER BUMPING TECHNOLOGY;

FLIP CHIP DEVICES;

EID: 0038346500     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-002-0247-x     Document Type: Article

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