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Volumn 29, Issue 4, 2003, Pages 42-50+9

The developing technologies of integrated optical waveguides in printed circuits

Author keywords

Interconnection; Printed circuit boards

Indexed keywords

CROSSTALK; INTEGRATED OPTICS; OPTICAL WAVEGUIDES; OPTOELECTRONIC DEVICES; SIGNAL INTERFERENCE;

EID: 0038339991     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120310478578     Document Type: Review
Times cited : (13)

References (10)
  • 1
    • 4243558375 scopus 로고    scopus 로고
    • New materials in optoelectronics - Advantages and challenges for polymers
    • 21-22 August 2001, Austin, TX
    • Erben, C. (2001), "New materials in optoelectronics - advantages and challenges for polymers", Second Optoelectronics Packaging Workshop, 21-22 August 2001, Austin, TX, pp. B1-B22.
    • (2001) Second Optoelectronics Packaging Workshop
    • Erben, C.1
  • 2
    • 0035422051 scopus 로고    scopus 로고
    • A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems
    • August 2001
    • Griese, E. (2001), "A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems", IEEE Transactions Advanced Packaging, Vol. 24 No. 3, August 2001, pp. 375-83.
    • (2001) IEEE Transactions Advanced Packaging , vol.24 , Issue.3 , pp. 375-383
    • Griese, E.1
  • 3
    • 0036602702 scopus 로고    scopus 로고
    • Optical interconnection technology for PCB applications
    • June 2002
    • Griese, E. (2002), "Optical interconnection technology for PCB applications", PCB Fab, June 2002, pp. 20-36.
    • (2002) PCB Fab , pp. 20-36
    • Griese, E.1
  • 5
  • 6
    • 0032640816 scopus 로고    scopus 로고
    • Optical interconnects by hot embossing for module and PCB technology - The EOCB approach
    • June 1999, San Diego, CA, USA
    • Krabe, D. and Scheel, W. (1999), "Optical interconnects by hot embossing for module and PCB technology - The EOCB approach", Proceedings of 49th Electronics Components and Technology Conference, June 1999, San Diego, CA, USA, pp. 1164-6.
    • (1999) Proceedings of 49th Electronics Components and Technology Conference , pp. 1164-1166
    • Krabe, D.1    Scheel, W.2
  • 8
    • 4243558375 scopus 로고    scopus 로고
    • Photonic and - Advantages and challenges for polymers
    • 21-22 August 2001, Austin, TX
    • Schroder, H. (2001), "Photonic and - advantages and challenges for polymers", Second Optoelectronics Packaging Workshop, 21-22 August 2001, Austin, TX, pp. B1-B22.
    • (2001) Second Optoelectronics Packaging Workshop
    • Schroder, H.1
  • 10
    • 4243552749 scopus 로고    scopus 로고
    • Chip-to-chip optical interconnect-optical pipedream?
    • 21-22 February 2001, Austin, TX
    • Watsun, J. (2001), "Chip-to-chip optical interconnect-optical pipedream?", First Optoelectronics Packaging Workshop, 21-22 February 2001, Austin, TX, pp. B1-B22.
    • (2001) First Optoelectronics Packaging Workshop
    • Watsun, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.