-
1
-
-
4243558375
-
New materials in optoelectronics - Advantages and challenges for polymers
-
21-22 August 2001, Austin, TX
-
Erben, C. (2001), "New materials in optoelectronics - advantages and challenges for polymers", Second Optoelectronics Packaging Workshop, 21-22 August 2001, Austin, TX, pp. B1-B22.
-
(2001)
Second Optoelectronics Packaging Workshop
-
-
Erben, C.1
-
2
-
-
0035422051
-
A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems
-
August 2001
-
Griese, E. (2001), "A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems", IEEE Transactions Advanced Packaging, Vol. 24 No. 3, August 2001, pp. 375-83.
-
(2001)
IEEE Transactions Advanced Packaging
, vol.24
, Issue.3
, pp. 375-383
-
-
Griese, E.1
-
3
-
-
0036602702
-
Optical interconnection technology for PCB applications
-
June 2002
-
Griese, E. (2002), "Optical interconnection technology for PCB applications", PCB Fab, June 2002, pp. 20-36.
-
(2002)
PCB Fab
, pp. 20-36
-
-
Griese, E.1
-
4
-
-
0035761238
-
Self-ligned coupling of optical transmitter and receiver modules to board-integrated multimode waveguides
-
Taghizadeh, MR., Thienpont, H. and Jabbour, G.E. (Eds)
-
Griese, E., Himmler, A., Klimke, K., Koske, A., Kropp, J-R., Lehmacher, S., Neyer, A. and Süllau, W. (2001), "Self-ligned coupling of optical transmitter and receiver modules to board-integrated multimode waveguides", in Taghizadeh, MR., Thienpont, H. and Jabbour, G.E. (Eds), Micro- and Nano-optics for Optical Interconnection and Information Processing, Proceedings of SPIE, Vol. 4455, pp. 243-50.
-
(2001)
Micro- and Nano-Optics for Optical Interconnection and Information Processing, Proceedings of SPIE
, vol.4455
, pp. 243-250
-
-
Griese, E.1
Himmler, A.2
Klimke, K.3
Koske, A.4
Kropp, J.-R.5
Lehmacher, S.6
Neyer, A.7
Süllau, W.8
-
5
-
-
0038589178
-
HDI's beneficial influence on high- frequency signal integrity
-
Holden, H. (2002), "HDI's beneficial influence on high- frequency signal integrity", New Technical Publications on Mentor, Part I and II, Web site: www.mentor.com/pcb
-
(2002)
New Technical Publications on Mentor, Part I and II
-
-
Holden, H.1
-
6
-
-
0032640816
-
Optical interconnects by hot embossing for module and PCB technology - The EOCB approach
-
June 1999, San Diego, CA, USA
-
Krabe, D. and Scheel, W. (1999), "Optical interconnects by hot embossing for module and PCB technology - The EOCB approach", Proceedings of 49th Electronics Components and Technology Conference, June 1999, San Diego, CA, USA, pp. 1164-6.
-
(1999)
Proceedings of 49th Electronics Components and Technology Conference
, pp. 1164-1166
-
-
Krabe, D.1
Scheel, W.2
-
7
-
-
0034476474
-
New technology for electrical/optical systems on module and board level: The EOCB approach
-
May 2000, Las Vegas, NV, USA
-
Krabe, D., Ebling, F., Arndt-Staufenbiel, N., Lang, G. and Scheel, W. (2000), "New technology for electrical/optical systems on module and board level: The EOCB approach", Proceedings of 50th Electronics Components and Technology Conference, May 2000, Las Vegas, NV, USA, pp. 970-4.
-
(2000)
Proceedings of 50th Electronics Components and Technology Conference
, pp. 970-974
-
-
Krabe, D.1
Ebling, F.2
Arndt-Staufenbiel, N.3
Lang, G.4
Scheel, W.5
-
8
-
-
4243558375
-
Photonic and - Advantages and challenges for polymers
-
21-22 August 2001, Austin, TX
-
Schroder, H. (2001), "Photonic and - advantages and challenges for polymers", Second Optoelectronics Packaging Workshop, 21-22 August 2001, Austin, TX, pp. B1-B22.
-
(2001)
Second Optoelectronics Packaging Workshop
-
-
Schroder, H.1
-
10
-
-
4243552749
-
Chip-to-chip optical interconnect-optical pipedream?
-
21-22 February 2001, Austin, TX
-
Watsun, J. (2001), "Chip-to-chip optical interconnect-optical pipedream?", First Optoelectronics Packaging Workshop, 21-22 February 2001, Austin, TX, pp. B1-B22.
-
(2001)
First Optoelectronics Packaging Workshop
-
-
Watsun, J.1
|