New non-destructive laser ablation based backside sample preparation method

Microelectronics Reliability

Volumn 40, Issue 8-10, 2000, Pages 1425-1429

  Beaudoin, F ^a   Saviot, F ^b   Lewis, D ^c   Perdu, P ^a   Salin, F ^d  

^a CNES   (France)

^b UNIVERSITÉ DE BORDEAUX   (France)

^c UNIVERSITÉ BORDEAUX 1   (France)

^d CENTRE LASERS INTENSES ET APPLICATIONS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0038231316     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00123-2     Document Type: Article

References (5)

1. nd ISTFA, Los Angeles, 1996, pp 393-399.
2. Barton D.L. Bernhard-Höfer K. and Cole Jr. E.I. FLIP-Chip and "Backside" Techniques. Microelectronics Reliability, 39, 1999, pp 721-730.
3. th ISTFA, Los Angeles, 1992, pp 1-7.
4. Salagoity M. Package Reliability, Tutorial ESREF, 1999, Arcachon, France.
5. Perdu P. Desplats R. and Beaudoin F. A Review of Sample Backside Preparation Techniques for VLSI. ESREF, 2000, Dresden, Germany.