Enhancing modulus and ductility of Mg/SiC composite through judicious selection of extrusion temperature and heat treatment

Materials Science and Technology

Volumn 19, Issue 6, 2003, Pages 803-808

  Lim, S C V ^a   Gupta, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; CORRELATION METHODS; DUCTILITY; ELASTIC MODULI; EXTRUSION; HARDNESS; HEAT TREATMENT; MAGNESIUM PRINTING PLATES; MICROSTRUCTURE; POROSITY; SILICON CARBIDE; SYNTHESIS (CHEMICAL); YIELD STRESS;

PARTICULATE CLUSTERS;

MATERIALS SCIENCE;

CARBON; MAGNESIUM; SILICON;

ARTICLE; CHEMICAL COMPOSITION; CHEMICAL PROCEDURES; CHEMICAL STRUCTURE; CONDUCTANCE; CORRELATION ANALYSIS; CRYSTALLIZATION; DEPOSITION; DISINTEGRATION; EXTRUSION; EXTRUSION TEMPERATURE; HARDNESS; HEAT TREATMENT; HIGH TEMPERATURE PROCEDURES; MECHANICS; MELTING POINT; PROCESS MODEL; PRODUCT RECOVERY; STANDARD; SYNTHESIS; TEMPERATURE MEASUREMENT; TENSILE STRENGTH; YOUNG MODULUS;

EID: 0038198890     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708303225002154     Document Type: Article

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