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Volumn 36, Issue 15, 2001, Pages 2627-2636
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Enhancing the microstructural and mechanical response of a Mg/SiC formulation by the method of reducing extrusion temperature
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Author keywords
A. Composites; D. Mechanical behavior; D. Microstructure
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Indexed keywords
ELASTIC MODULI;
EXTRUSION;
HARDNESS;
MAGNESIUM PRINTING PLATES;
MICROSTRUCTURE;
POROSITY;
SILICON CARBIDE;
THERMAL EFFECTS;
MECHANICAL RESPONSE;
MELT DEPOSITION;
COMPOSITE MATERIALS;
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EID: 0035576084
PISSN: 00255408
EISSN: None
Source Type: Journal
DOI: 10.1016/S0025-5408(01)00750-4 Document Type: Article |
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Times cited : (30)
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References (16)
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