Patterning of Cu, Co, Fe, and Ag for magnetic nanostructures

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 15, Issue 3, 1997, Pages 1780-1784

  Jung, K B ^a   Lee, J W ^a   Park, Y D ^a   Caballero, J A ^a   Childress, J R ^a   Pearton, S J ^a   Ren, F ^b  

^a University of Florida   (United States)

^b LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AR PLASMA TREATMENT; AR PLASMAS; CORROSION PROBLEMS; ETCH RATES; ETCH RESISTANCE; ETCH SELECTIVITY; IN-SITU; ION ENERGIES; ION FLUXES; MAGNETIC FIELD SENSORS; MAGNETIC NANOSTRUCTURES; MEMORY DEVICE; MICROWAVE POWER; PHOTORESIST MASK; PLASMA CHEMISTRIES; REACTIVE ION ETCH; ROOM TEMPERATURE; SPIN-VALVE GIANT MAGNETORESISTANCE; SURFACE RESIDUES; THIN METALLIC MULTILAYERS; WET AND DRY;

ARGON; COPPER COMPOUNDS; CYCLOTRONS; ELECTRIC DISCHARGES; ELECTRIC RESISTANCE; ELECTRON CYCLOTRON RESONANCE; FILM PREPARATION; IONS; MAGNETIC FIELD EFFECTS; MULTILAYERS; PHOTORESISTS; PLASMA ETCHING; SILICON NITRIDE;

GIANT MAGNETORESISTANCE;

EID: 0038185968     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.580869     Document Type: Article

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