Optimization of process conditions for the transfer molding of electronic packages

Journal of Materials Processing Technology

Volumn 138, Issue 1-3, 2003, Pages 361-365

  Tong, K W ^a   Kwong, C K ^a   Ip, K W ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Electronic packages; Process condition; Process simulation; Taguchi method; TOPSIS; Transfer molding

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; PROCESS ENGINEERING; TRANSFER MOLDING;

PROCESS SIMULATION;

ELECTRONICS PACKAGING;

EID: 0038142311     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(03)00099-2     Document Type: Conference Paper

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