Anisotropic copper etching with monoethanolamine-complexed cupric ion solutions

Journal of Applied Electrochemistry

Volumn 33, Issue 5, 2003, Pages 403-410

  Shih, C W ^a   Wang, Y Y ^a   Wan, C C ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Etching factor; Inhibition; Monoethanolamine; Non ammonia etching

Indexed keywords

ACTIVATION ENERGY; ADSORPTION; ANISOTROPY; CHEMISORPTION; COPPER; ELECTROCHEMICAL CORROSION; PH EFFECTS; PRINTED CIRCUIT BOARDS; REACTION KINETICS; SOLUTIONS;

ACID REACTION; AMMONIACAL ETCHANT; ANISOTROPIC COPPER ETCHING; CORROSION CURRENT DENSITY; CUPRIC ETCHANT; FORWARD ETCHANT; MONOETHANOLAMINE COMPLEXED CUPRIC ION SOLUTIONS; SPRAY ETCHING;

ETCHING;

EID: 0038107704     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1024408105251     Document Type: Article

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