Allowable copper thickness for fine pitch patterns formed by a subtractive method

Circuit World

Volumn 27, Issue 1, 2001, Pages 6-12

  Yamamoto, Takuya ^a   Kataoka, Takashi ^a   Andresakis, John ^b  

^a MITSUI MINING AND SMELTING CO LTD   (Japan)

^b Oak Mitsui   (United States)

Author keywords

Copper; Etchants; Etching; HDIS circuits; Printed circuit boards

Indexed keywords

COPPER; ETCHING; PHOTORESISTS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; THICKNESS MEASUREMENT;

ETCHANTS; PITCH PATTERNS; SUBTRACTIVE METHOD;

PRINTED CIRCUIT MANUFACTURE;

EID: 0034435814     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120110360237     Document Type: Article

References (1)

1. JPCA (1998), Report on the Trends of the Next-generation, Ultra-small, High-speed Circuit Mounting Technology, June, compiled by Japan Printed Circuit Association (JPCA).