Materials characterization and requirements of package applied underfill

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 978-982

  Shah, Jayesh ^a   Morganelli, Paul ^a   Wheelock, Brian ^a  

^a Emerson and Cuming Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CAPILLARY FLOW; CHARACTERIZATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ENCAPSULATION; FILLERS; INTEGRATED CIRCUIT MANUFACTURE; REACTION KINETICS; RHEOLOGY; SURFACE MOUNT TECHNOLOGY;

CAPILLARY UNDERFILL TECHNOLOGY; FLUXING CAPABILITIES; NO-FLOW UNDERFILL TECHNOLOGY; UNDERFILLING;

CHIP SCALE PACKAGES;

EID: 0038012480     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. J.H.Lau, Ed., "Chip on Board", Van Nostrand Reinhold, 1994
2. Paul Morganelli and Brian Wheelock, "Viscosity of no Flow Underfill During Reflow and its Relationship to Solder Wetting" Electronic Components and Technology Conference, May, 2001