Using an immersion-type BEOL cleaner with hydroxylamine and fluorine chemistries

MICRO

Volumn 21, Issue 3, 2003, Pages 31-36

  Song, Jae Inh ^a   Novak, Richard ^a  

^a Akrion   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMINES; CORROSION; CORROSION INHIBITORS; DIFFUSION IN SOLIDS; FLUORINE; GAS CHROMATOGRAPHY; INTEGRATED CIRCUITS; MASS SPECTROMETRY; PERMITTIVITY; PH EFFECTS; PLASMA ETCHING; SCANNING ELECTRON MICROSCOPY;

BACK-END-OF-LINE (BEOL) CLEANING;

SURFACE CLEANING;

EID: 0037835764     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. M Igarashi et al., "The Best Combination of Aluminum and Copper Interconnects for High Performance 0.18 μm CMOS Logic Devices," in Proceedings of the International Electron Devices Meetings (Gaithersburg, MD: IEDM, 1998), 829-832.
2. J Song, Akrion marketing data (Allentown, PA: Akrion, 2000).
3. C Helms, "Contamination Control and Defect Reduction in Semiconductor Manufacturing III," EKC Technology technical data (Danville, CA: EKC Technology, 1994), 22.
4. D Follweiler and D Peters, "Recycling of Solvents in Used Photoresist Strippers," in Proceedings of the Fourth International Symposium on Environmental Issues with Materials and Processes for the Electronics and Semiconductor Industries (Pennington, NJ: Electrochemical Society, 2001).
5. P Marcus and J Oudar, "Corrosion Mechanism in Theory and Practice" (New York: Marcel Dekker, 1995).
6. E Flick, Corrosion Inhibitors, Industrial Guide (Westwood, NJ: Noyes Publications, 1993).