Low temperature PECVD SiNx films applied in OLED packaging

Materials Science and Engineering: B

Volumn 98, Issue 3, 2003, Pages 248-254

  Huang, Weidong ^a,b   Wang, Xuhong ^b   Sheng, Mei ^b   Xu, Liqiang ^b   Stubhan, Frank ^b   Luo, Le ^a   Feng, Tao ^c   Wang, Xi ^c   Zhang, Fumin ^c   Zou, Shichang ^c  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b DaimlerChrysler SIM Technology Co Ltd   (China)

^c INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

OLED; Packaging; PECVD; Thin film

Indexed keywords

BONDING; COMPOSITION; DENSITY (OPTICAL); ELECTRONICS PACKAGING; ENCAPSULATION; FILMS; LIGHT EMITTING DIODES; MOISTURE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REFRACTIVE INDEX; SUBSTRATES; TEMPERATURE;

MOISTURE RESISTANCE;

SILICON COMPOUNDS;

EID: 0037799508     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(03)00045-X     Document Type: Article

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