Decreasing variation in paste printing using statistical process control

Microelectronics Reliability

Volumn 43, Issue 7, 2003, Pages 1157-1161

  Liukkonen, Timo ^a   Tuominen, Aulis ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SOFTWARE; PRINTED CIRCUIT BOARDS; STATISTICAL PROCESS CONTROL; VISCOSITY;

PRINTING QUALITY;

PRINTING;

EID: 0037774838     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00102-1     Document Type: Conference Paper

References (9)

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2. Barajas L.et al. On-line enhancements of the stencil printing process. Circuits Assembly. 12(3):2001;32-34. 36.
3. Barajas L et al. A closed-loop control algorithm for stencil printing. SMTA, Third Annual Advanced Technology Symposium, Boston, MA, June 2002.
4. Forsten A. Liukkonen T. Method for monitoring solder paste printing process. United States Patent no. US 6,342,266 B1, 29 January 2002.
5. Kirkpatrick R. Two-dimensional, closed-loop inspection of stencil printing. Surf. Mount Technol. 13(7):1999;56-58.
6. Chrysler Corporation, Ford motor company, and General motors company, "Statistical Process Control (SPC)", Reference Manual, Carwin Continuous Ltd., March 1995, pp. 9, 21, 22, 37.
7. Breyfogle F. Implementing six sigma. 1999;John Wiley & Sons Inc. p. 152, 288.
8. Montgomery D. Introduction to statistical quality control. 4th ed. 2001;John Wiley & Sons Inc. pp. 12-15, 55-82, 154-156, 164-165, 170, 175-177, 184-188, 207.
9. Salomäki R. Hyödynnä SPC, MET, Jyväskylä 1999. pp. 172-174, 184-185, 197-200.