Tribological characterization of post-CMP brush scrubbing

Solid State Phenomena

Volumn 92, Issue , 2003, Pages 275-280

  Philipossian, Ara ^a   Mustapha, Lateef ^a  

^a University of Arizona   (United States)

Author keywords

Brush scrubbing; Coefficient of friction; Post CMP cleaning; PVA; Tribology

Indexed keywords

BRUSHES; CHARACTERIZATION; FLUID DYNAMICS; KINEMATICS; TRIBOLOGY; CHEMICAL ANALYSIS; CLEANING; SILICON WAFERS;

BRUSH SCRUBBING; LIQUID WAFER CHEMICAL INTERACTION; TRIBOLOGICAL CHARACTERIZATION; CHEMICAL INTERACTIONS; COEFFICIENT OF FRICTIONS; FREQUENCY ANALYSIS; FRICTION SIGNALS; POST-CMP CLEANING; TRIBOLOGICAL MECHANISM;

CHEMICAL MECHANICAL POLISHING; FRICTION;

EID: 0037701650     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

References (8)

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