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Volumn , Issue , 1999, Pages 215-217
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PVD Aluminum dual damascene interconnection: Yield comparison between counterbore and self aligned approaches
a a a a a a a a a a b b b b b b b |
Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
ASPECT RATIO;
CHEMICAL MECHANICAL POLISHING;
DEFECT DENSITY;
PHOTORESISTS;
COMPARATIVE STUDIES;
DUAL DAMASCENE;
DUAL DAMASCENE INTERCONNECTION;
DUMMY STRUCTURES;
ETCH PROCESS;
HIGH ASPECT RATIO;
INTERCONNECT LINES;
YIELD DEGRADATION;
INTEGRATED CIRCUIT INTERCONNECTS;
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EID: 0037691138
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IITC.1999.787126 Document Type: Conference Paper |
Times cited : (2)
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References (8)
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