Microwave bonding of silicon dies with thin metal films for MEMS applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 18-23

  Clendenin, Jason ^a   Tung, Steve ^a   Budraa, Nasser ^b   Mai, John ^b  

^a University of Arkansas   (United States)

^b Microwave Bonding Instruments Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DIES; HEATING; INFRARED IMAGING; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; NUMERICAL METHODS; SEMICONDUCTING SILICON; THIN FILMS; TRANSIENTS;

MICROWAVE BONDING; SILICON DIES; SILICON TO SILICON DIE STACK; THIN GOLD FILMS; THIN METAL FILMS;

MICROWAVE CIRCUITS;

EID: 0037675727     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Nasser Budraa, H.W. Jackson, M. Barmatz, William T. Pike, and John D. Mai, "Low Pressure and Low Temperature Hermetic Wafer Bonding using Microwave Heating," 12th Annual IEEE International MEMS'99 Conference, Orlando Florida, January 17-21, 1999
2. Keith Thompson, Yogesh Gianchandani, John Booske, Reid Cooper, "Si-Si Bonding Using RF and Microwave Radiation," IEEE Transducers 2001.
3. Jongbaeng Kim, Mu Chiao, Liwei Lin, "Ultrasonic Bonding of In/Au and AI/AI for Hermetic Sealing of MEMS Packaging," IEEE MEMS 2002 Conference, Las Vegas, NV, January 20-24, 2002.
4. Andrey Bayrashev, Babak Ziaie, "Silicon Wafer Bonding with an Insulator Interlayer Using RF Dielectric Heating," IEEE MEMS 2002 Conference, Las Vegas, NV, January 20-24, 2002.
5. R.M.Hutcheon, M. de Jong, and F.P.Adams, "A System for Rapid Measurements of RF and Microwave Properties Up to 1400° C," Journal of Microwave power & Electromagnetic Energy, 27, #2, 87 (1992).
6. A. F. Harvey, Microwave Engineering, Pg. 247-252, Academic Press, New York, 1963.