Underfill-induced stresses in flip chip assemblies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 957-961

  Hurley, James M ^a   Berfield, Tanya L ^a  

^a Cookson Electron Assembly Mat Grp ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; DIES; ELECTRONICS PACKAGING; FILLERS; FRACTURE MECHANICS; GLASS TRANSITION; INTEGRATED CIRCUIT MANUFACTURE; LAMINATES; SILICA; STRESS INTENSITY FACTORS; TEMPERATURE; THERMAL EXPANSION;

BIMETALLIC BEAM THEORY; FLIP CHIP ON BOARD; LINEAR ELASTIC FRACTURE MECHANICS; SILICA FILLED ANHYDRIDE CURED EPOXIES; STRESS INDEX FORMULA; UNDERFILL DIE LAMINATES; UNDERFILL INDUCED STRESSES;

FLIP CHIP DEVICES;

EID: 0037674591     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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