Thermal conductivity influence in SMT reflow soldering process

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1613-1616

  Svasta, Paul ^a   Simion Zanescu, Daniel ^a   Willi, Ciszkowski ^a  

^a UNIVERSITY POLITEHNICA OF BUCHAREST   (Romania)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ENERGY DISSIPATION; HEAT TRANSFER; MATHEMATICAL MODELS; PHYSICAL PROPERTIES; PRINTED CIRCUIT BOARDS; RADIATION; SURFACE MOUNT TECHNOLOGY; THERMAL CONDUCTIVITY; TOPOLOGY;

INTERCONNECTION DENSITY; REFLOW SOLDERING;

SOLDERING;

EID: 0036287716     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Thermal conductivity influence in SMT reflow soldering