Dependence of the bonding structure of DLC thin films on the deposition conditions of PECVD method

Surface and Coatings Technology

Volumn 169-170, Issue , 2003, Pages 291-294

  Kim, Y T ^a   Cho, S M ^a   Choi, W S ^a   Hong, B ^a   Yoon, D H ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

DLC; PECVD; Raman scattering spectroscopy; Roughness

Indexed keywords

ATOMIC FORCE MICROSCOPY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON WAFERS; SURFACE ROUGHNESS;

BONDING STRUCTURE;

THIN FILMS;

BOND STRENGTH; COATING; DEPOSITION; DIAMOND-LIKE CARBON; FILM; STRUCTURAL ANALYSIS; SURFACE TREATMENT; VAPOR DEPOSITION;

EID: 0037671447     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(03)00069-0     Document Type: Article

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