Processing effects on structure-property relationships in sputter deposited thin gold films

Materials Science Forum

Volumn 426-432, Issue 4, 2003, Pages 3403-3408

  Moody, N R ^a   Adams, D P ^b   Medlin, D ^a   Headley, T ^b   Yang, N ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Delamination; Film structure; Gold films; Interfacial fracture energy; Nanoindentation

Indexed keywords

COMPOSITION; DISSIMILAR MATERIALS; FRACTURE TOUGHNESS; GOLD; SPUTTER DEPOSITION;

INTERFACE STRUCTURE;

THIN FILMS;

EID: 0037662051     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.426-432.3403     Document Type: Conference Paper

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