SiC to SiC wafer bonding

Materials Research Society Symposium - Proceedings

Volumn 742, Issue , 2002, Pages 91-95

  Yushin, G N ^a   Kvit, A V ^a   Collazo, R ^a   Sitar, Z ^a  

^a North Carolina State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; INTERFACES (MATERIALS); SILICON CARBIDE; SURFACE ROUGHNESS; THERMAL CONDUCTIVITY; TRANSMISSION ELECTRON MICROSCOPY;

VACUUM BONDING CHAMBER;

SILICON WAFERS;

EID: 0037617937     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-742-k2.5     Document Type: Conference Paper

References (8)

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