Copper nanorod junctions templated by a novel polymer-surfactant aggregate

Journal of Crystal Growth

Volumn 254, Issue 1-2, 2003, Pages 164-168

  Cao, Xuebo ^a   Yu, Fei ^a   Li, Linying ^a   Yao, Zhenyu ^a   Xie, Yi ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

A1. Crystal morphology; A1. Nanostructures; A2. Solution growth; B1. Copper

Indexed keywords

ABSORPTION SPECTROSCOPY; COPPER; MICROSTRUCTURE; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR JUNCTIONS; SURFACE ACTIVE AGENTS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

NOVEL SOFT TEMPLATES;

NANOSTRUCTURED MATERIALS;

EID: 0037609780     PISSN: 00220248     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-0248(03)01115-1     Document Type: Article

References (27)

1. Kottmann J.P., Martin O.J.F., Smith D.R., Schultz S. Chem. Phys. Lett. 341:2001;1.
2. Yang W.H., Schatz G.C., Van Duyne R.P. J. Chem. Phys. 103:1995;869.
3. Chen S.H., Carroll D.L. Nano Lett. 2:2002;1003.
4. Mulvaney P. Langmuir. 12:1996;788.
5. Adelung R., Ernst F., Scott A., Tabib-Azar M., Kipp L., Skibowski M., Hollensteiner S., Spiecker E., Jager W., Gunst S., Klein A., Jagermann W., Zaporojtchenko V., Faupel F. Adv. Mater. 14:2002;1056.
6. Peng L.Q., Ju X., Wang S.C., Xian D.C., Chen H., He Y.J. Chin. Phys. Lett. 16:1999;126.
7. Toilmil Molares M.E., Buschmann V., Dobrev D., Neumann R., Scholz R., Schuchert I.U., Vetter J. Adv. Mater. 13:2001;62.
8. Toilmil Molares M.E., Brötz J., Buschmann V., Dobrev D., Neumann R., Scholz R., Schuchert I.U., Trautmann C., Vetter J. Nucl. Instr. and Meth. B. 185:2001;192.
9. Lisiecki I., Filankembo A., Sack-Kongehl H., Weiss K., Pileni M.P., Urban J. Phys. Rev. B. 61:2000;4968.
10. Lisiecki I., Billoudet F., Pileni M.P. J. Phys. Chem. 100:1996;4160.
11. Leontidis E., Kyprianidou-Leodidou T., Caseri W., Robyr P., Krumeich F., Kyriacou K.C. J. Phys. Chem. B. 105:2001;4133.
12. Leontidis E., Kyprianidou-Leodidou T., Caseri W., Kyriacou K.C. Langmuir. 15:1999;3381.
13. Goddard E.D. Colloids Surf. 19:1986;255.
14. Stoll S., Buffle J. J. Colloid Interf. Sci. 180:1996;548.
15. J. Philip, T. Jaykumar, P. Kalyanasundaram, B. Raj, O. Mondain-Monval, Phys. Rev. 66 (011406) (Part 1) (2002) 1406.
16. Ballerat-Busserolles K., Meunier L., Roux A.H., Roux-Desgranges G. Phys. Chem. Chem. Phys. 3:2001;2872.
17. Wang Z.L., Pan Z.W. Adv. Mater. 14:2002;1029.
18. Luo J., Zhang L., Zhang Y.J., Zhu J. Adv. Mater. 14:2002;1413.
19. Walsh D., Hopwood J.D., Mann S. Science. 264:1994;1576.
20. Walsh D., Mann S. Nature. 377:1995;320.
21. Kresge C.T., Leonowicz M.E., Roth W.J., Vartuli J.C., Beck J.S. Nature. 359:1992;710.
22. Murphy C.J., Jana N.R. Adv. Mater. 14:2002;80.
23. Chen D.H., Huang Y.W. J. Colloid Interf. Sci. 255:2002;299.
24. Weast R.C. Handbook of Chemistry and Physics. 56th Edition:1975;CRC Press, Cleveland.
25. Arul Dhas N., Paul Raj C., Gedanken A. Chem. Mater. 10:1998;1446.
26. EI-Sayed M.A. Acc. Chem. Res. 34:2001;257.
27. Dan N. Trends Biotechnol. 18:2000;370.