Interface development and encapsulation in simultaneous connection molding of disk. II. Two-dimensional simulation and experiment

Journal of Applied Polymer Science

Volumn 88, Issue 9, 2003, Pages 2310-2318

  Li, C T ^a   Lee, D J ^a   Isayev, A I ^a  

^a University of Akron   (United States)

Author keywords

Break through; Coinjection molding; Encapsulat ion; Experiment; Interface evolution; Rheology; Simulation; Thermoplastics

Indexed keywords

COMPUTER SIMULATION; ENCAPSULATION; INTERFACES (MATERIALS); MATHEMATICAL MODELS; RHEOLOGY; THERMOPLASTICS;

INTERFACE EVOLUTION;

INJECTION MOLDING;

ENCAPSULATION; MATHEMATICAL MODELING; MOLDING; RHEOLOGY; THERMOPLASTIC;

EID: 0037475166     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.11948     Document Type: Article

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