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1
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0030182427
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Analysis and design considerations of three-dimensional vector accelerometer using SOI structure for wide temperature range
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H. Takao, Y. Matsumoto, H.D. Seo, M. Ishida, T. Nakamura, Analysis and design considerations of three-dimensional vector accelerometer using SOI structure for wide temperature range, Sens. Actuators A 55 (2) (1996) 91-97.
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(1996)
Sens. Actuators A
, vol.55
, Issue.2
, pp. 91-97
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Takao, H.1
Matsumoto, Y.2
Seo, H.D.3
Ishida, M.4
Nakamura, T.5
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3
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0013440438
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Thermostatic control for temperature compensation of a silicon pressure sensor
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2B3.4
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D. De Bruyker, R. Puers, Thermostatic control for temperature compensation of a silicon pressure sensor, Transducers'99 2B3.4 (1999) 358-361.
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(1999)
Transducers'99
, pp. 358-361
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De Bruyker, D.1
Puers, R.2
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4
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0025698091
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A novel silicon accelerometer with a surrounding mass structure
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K. Yamada, K. Higuchi, H. Tanigawa, A novel silicon accelerometer with a surrounding mass structure, Sens. Actuators A 21/23 (1990) 308-311.
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(1990)
Sens. Actuators A
, vol.21-23
, pp. 308-311
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Yamada, K.1
Higuchi, K.2
Tanigawa, H.3
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5
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0032002191
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Stress-sensitive differential amplifiers using piezoresistive effects of MOSFETs and their application to three-axial accelerometers
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H. Takao, Y. Matsumoto, M. Ishida, Stress-sensitive differential amplifiers using piezoresistive effects of MOSFETs and their application to three-axial accelerometers, Sens. Actuators A 65 (1998) 61-68.
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(1998)
Sens. Actuators A
, vol.65
, pp. 61-68
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Takao, H.1
Matsumoto, Y.2
Ishida, M.3
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6
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0032760790
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An integrated three-axis accelerometer using CMOS compatible stress-sensitive differential amplifiers
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H. Takao, Y. Matsumoto, M. Ishida, An integrated three-axis accelerometer using CMOS compatible stress-sensitive differential amplifiers, IEEE Trans. Electron Devices 46 (1) (1999) 109-116.
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(1999)
IEEE Trans. Electron Devices
, vol.46
, Issue.1
, pp. 109-116
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Takao, H.1
Matsumoto, Y.2
Ishida, M.3
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7
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0035445594
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A CMOS integrated three-axis accelerometer fabricated with commercial sub-micron CMOS technology and bulk-micromachining
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H. Takao, H. Fukumoto, M. Ishida, A CMOS integrated three-axis accelerometer fabricated with commercial sub-micron CMOS technology and bulk-micromachining, IEEE Trans. Electron Devices 48 (9) (2001) 1961-1968.
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(2001)
IEEE Trans. Electron Devices
, vol.48
, Issue.9
, pp. 1961-1968
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Takao, H.1
Fukumoto, H.2
Ishida, M.3
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8
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0026898739
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Anisotropic etching of silicon in TMAH solutions
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O. Tabata, R. Asahi, H. Funabashi, K. Shimaoka, S. Su, Anisotropic etching of silicon in TMAH solutions, Sens. Actuators A 34 (1992) 51-57.
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(1992)
Sens. Actuators A
, vol.34
, pp. 51-57
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Tabata, O.1
Asahi, R.2
Funabashi, H.3
Shimaoka, K.4
Su, S.5
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9
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0013449833
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A Study on a CMOS integrated three axial accelerometer based on piezoresistivity effect in p-type inversion layers
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H. Takao, Y. Matsumoto, M. Ishida, A Study on a CMOS integrated three axial accelerometer based on piezoresistivity effect in p-type inversion layers, IEE Jpn. 14 (1996) 71-80.
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(1996)
IEE Jpn.
, vol.14
, pp. 71-80
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Takao, H.1
Matsumoto, Y.2
Ishida, M.3
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10
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23544453803
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Etching method of glass and silicon for silicon accelerometer fabrication: Technical meeting on sensor technology
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Y. Matsumoto, A. Okada, K. Kawai, H. Takao, H.D. Seo, T. Nakamura, Etching method of glass and silicon for silicon accelerometer fabrication: technical meeting on sensor technology, IEE Jpn. ST-94-6 (1994) 41-50.
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(1994)
IEE Jpn.
, vol.ST-94-6
, pp. 41-50
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Matsumoto, Y.1
Okada, A.2
Kawai, K.3
Takao, H.4
Seo, H.D.5
Nakamura, T.6
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