Temperature-sensitivity of coating copper on sub-micron silicon carbide particles by electroless deposition in a rotation flask

Surface and Coatings Technology

Volumn 166, Issue 1, 2003, Pages 67-71

  Zhang, Rui ^a,b   Gao, Lian ^a   Guo, Jingkun ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

^b ZHENGZHOU UNIVERSITY   (China)

Author keywords

Copper; Cuprous oxide; Electroless deposition; Grain growth; Silicon carbide

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; CRYSTALLINE MATERIALS; ELECTROLESS PLATING; OXIDATION; PARTICLE SIZE ANALYSIS; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

CEMENTATION REACTIONS;

SILICON CARBIDE;

COATING; COPPER; DEPOSITION; ELECTROLESS PLATING; SILICON CARBIDE; TEMPERATURE EFFECT;

EID: 0037416545     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(02)00748-X     Document Type: Article

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