-
1
-
-
0031231461
-
Inclusion and inhomogeneities in transversely isotropic piezoelectric solids
-
Dunn M.L., Wienecke H.A. Inclusion and inhomogeneities in transversely isotropic piezoelectric solids. International Journal of Solids and Structures. 34:1997;3571-3582.
-
(1997)
International Journal of Solids and Structures
, vol.34
, pp. 3571-3582
-
-
Dunn, M.L.1
Wienecke, H.A.2
-
3
-
-
0026678910
-
Three-dimensional analysis of an ellipsoidal inclusion in a piezoelectric material
-
Wang B. Three-dimensional analysis of an ellipsoidal inclusion in a piezoelectric material. International Journal of Solids and Structures. 29:1992;293-308.
-
(1992)
International Journal of Solids and Structures
, vol.29
, pp. 293-308
-
-
Wang, B.1
-
4
-
-
0002631757
-
Exact results in the micromechanics of fibrous piezoelectric composites exhibiting pyroelectricity
-
Benveniste Y. Exact results in the micromechanics of fibrous piezoelectric composites exhibiting pyroelectricity. Proceedings of the Royal Society of London A. 441:1993;59-81.
-
(1993)
Proceedings of the Royal Society of London A
, vol.441
, pp. 59-81
-
-
Benveniste, Y.1
-
5
-
-
0001652353
-
An analysis of piezoelectric composite materials containing ellipsoidal inhomogeneities
-
Dunn M.L., Taya M. An analysis of piezoelectric composite materials containing ellipsoidal inhomogeneities. Proceedings of the Royal Society of London A. 443:1993;265-287.
-
(1993)
Proceedings of the Royal Society of London A
, vol.443
, pp. 265-287
-
-
Dunn, M.L.1
Taya, M.2
-
6
-
-
0028282287
-
Electroelastic Green's functions for transversely isotropic piezoelectric media and their application to the solution of inclusion and inhomogeneity problems
-
Dunn M.L. Electroelastic Green's functions for transversely isotropic piezoelectric media and their application to the solution of inclusion and inhomogeneity problems. International Journal of Engineering Science. 32:1994;119-131.
-
(1994)
International Journal of Engineering Science
, vol.32
, pp. 119-131
-
-
Dunn, M.L.1
-
7
-
-
0026678679
-
Circular inclusion problem in antiplane piezoelectricity
-
Pak E.Y. Circular inclusion problem in antiplane piezoelectricity. International Journal of Solids and Structures. 29:1992;2403-2419.
-
(1992)
International Journal of Solids and Structures
, vol.29
, pp. 2403-2419
-
-
Pak, E.Y.1
-
8
-
-
36449009582
-
Stress relaxation of passivated aluminum line metalization on silicon substrates
-
Korhonen M.A., Black R.D., Li C.Y. Stress relaxation of passivated aluminum line metalization on silicon substrates. Journal of Applied Physics. 69:1991;1748-1755.
-
(1991)
Journal of Applied Physics
, vol.69
, pp. 1748-1755
-
-
Korhonen, M.A.1
Black, R.D.2
Li, C.Y.3
-
9
-
-
0000365719
-
Stress distribution in an aluminum interconnect of very large scale integration
-
Niwa H., Yagi H., Tsuchikawa H., Kato M. Stress distribution in an aluminum interconnect of very large scale integration. Journal of Applied Physics. 68:1990;328-333.
-
(1990)
Journal of Applied Physics
, vol.68
, pp. 328-333
-
-
Niwa, H.1
Yagi, H.2
Tsuchikawa, H.3
Kato, M.4
-
10
-
-
0027887532
-
Stress-induced void formation in metallization for integrated circuits
-
Okabayashi H. Stress-induced void formation in metallization for integrated circuits. Materials Science and Engineering (R). 1993;191-241.
-
(1993)
Materials Science and Engineering (R)
, pp. 191-241
-
-
Okabayashi, H.1
-
11
-
-
0032275488
-
Uniformity of stresses within a three-phase elliptic inclusion in anti-plane shear
-
Ru C.Q., Schiavone P., Mioduchowski A. Uniformity of stresses within a three-phase elliptic inclusion in anti-plane shear. Journal of Elasticity. 52:1999;121-128.
-
(1999)
Journal of Elasticity
, vol.52
, pp. 121-128
-
-
Ru, C.Q.1
Schiavone, P.2
Mioduchowski, A.3
-
13
-
-
84860749639
-
Critical thickness condition for growth of strained quantum wires in substrate V-grooves
-
Freund L.B., Willis J.R. Critical thickness condition for growth of strained quantum wires in substrate V-grooves. Applied Physics Letters. 66:1995;2822-2824.
-
(1995)
Applied Physics Letters
, vol.66
, pp. 2822-2824
-
-
Freund, L.B.1
Willis, J.R.2
-
14
-
-
0000482066
-
Mechanical stability and electronic properties of buried strained quantum wire arrays
-
Gosling T.J., Willis J.R. Mechanical stability and electronic properties of buried strained quantum wire arrays. Journal of Applied Physics. 77:1995;5601-5610.
-
(1995)
Journal of Applied Physics
, vol.77
, pp. 5601-5610
-
-
Gosling, T.J.1
Willis, J.R.2
-
15
-
-
0001207033
-
Elastic and piezoelectric fields around a buried quantum dot: A simple picture
-
Davies J.H. Elastic and piezoelectric fields around a buried quantum dot: A simple picture. Journal of Applied Physics. 84:1998;1358-1365.
-
(1998)
Journal of Applied Physics
, vol.84
, pp. 1358-1365
-
-
Davies, J.H.1
-
16
-
-
0001330315
-
A simple method for calculating strain distribution in quantum-wire structures
-
Faux D.A., Downes J.R., O'Reilly E. A simple method for calculating strain distribution in quantum-wire structures. Journal of Applied Physics. 80:1996;2515-2517.
-
(1996)
Journal of Applied Physics
, vol.80
, pp. 2515-2517
-
-
Faux, D.A.1
Downes, J.R.2
O'Reilly, E.3
-
17
-
-
3242838050
-
Analytic solutions for strain distribution in quantum-wire structures
-
Faux D.A., Downes J.R., O'Reilly E.P. Analytic solutions for strain distribution in quantum-wire structures. Journal of Applied Physics. 82:1997;3754-3762.
-
(1997)
Journal of Applied Physics
, vol.82
, pp. 3754-3762
-
-
Faux, D.A.1
Downes, J.R.2
O'Reilly, E.P.3
-
18
-
-
0001163304
-
Analysis of localized confinement potential in semiconductor strained wires and dots buried in lattice-mismatched materials
-
Nishi K., Yamaguchi A., Ahopelto A., Usui A., Sakaki H. Analysis of localized confinement potential in semiconductor strained wires and dots buried in lattice-mismatched materials. Journal of Applied Physics. 76:1994;7437-7445.
-
(1994)
Journal of Applied Physics
, vol.76
, pp. 7437-7445
-
-
Nishi, K.1
Yamaguchi, A.2
Ahopelto, A.3
Usui, A.4
Sakaki, H.5
-
19
-
-
0035333784
-
Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections
-
Gungor M.R., Maroudas D. Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections. International Journal of Fracture. 109:2001;47-68.
-
(2001)
International Journal of Fracture
, vol.109
, pp. 47-68
-
-
Gungor, M.R.1
Maroudas, D.2
-
20
-
-
0035932906
-
An exact solution for the three-phase piezoelectric cylinder model under antiplane shear and its applications to piezoelectric composites
-
Jiang C.P., Cheung Y.K. An exact solution for the three-phase piezoelectric cylinder model under antiplane shear and its applications to piezoelectric composites. International Journal of Solids and Structures. 38:2001;4777-4796.
-
(2001)
International Journal of Solids and Structures
, vol.38
, pp. 4777-4796
-
-
Jiang, C.P.1
Cheung, Y.K.2
-
21
-
-
0035341668
-
A generalized self-consistent method for piezoelectric fiber reinforced composites under antiplane shear
-
Jiang C.P., Tong Z.H., Cheung Y.K. A generalized self-consistent method for piezoelectric fiber reinforced composites under antiplane shear. Mechanics of Materials. 33:2001;295-308.
-
(2001)
Mechanics of Materials
, vol.33
, pp. 295-308
-
-
Jiang, C.P.1
Tong, Z.H.2
Cheung, Y.K.3
-
22
-
-
0000400528
-
Effect of interphase layer on thermal stresses within an elliptical inclusion
-
Ru C.Q. Effect of interphase layer on thermal stresses within an elliptical inclusion. Journal of Applied Physics. 84:1998;4872-4879.
-
(1998)
Journal of Applied Physics
, vol.84
, pp. 4872-4879
-
-
Ru, C.Q.1
-
23
-
-
0036416171
-
A three-phase circular inhomogeneity with imperfect interface under thermomechanical loadings in plane elasticity
-
Sudak L.J., Mioduchwoski A. A three-phase circular inhomogeneity with imperfect interface under thermomechanical loadings in plane elasticity. Acta Mechanica. 158:2002;43-56.
-
(2002)
Acta Mechanica
, vol.158
, pp. 43-56
-
-
Sudak, L.J.1
Mioduchwoski, A.2
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