|
|
|
Volumn 4428, Issue , 2001, Pages 22-25
|
|
Increasing yields in high-density MCM-C substrate manufacturing
a
a
NONE
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
AUTOMATION;
CERAMIC MATERIALS;
ELECTRONICS PACKAGING;
INSPECTION;
INTEGRATED CIRCUIT LAYOUT;
INTEGRATED CIRCUIT MANUFACTURE;
INTEGRATED CIRCUIT TESTING;
MECHANICAL PROPERTIES;
PROCESS CONTROL;
SUBSTRATES;
AUTOMATED OPTICAL INSPECTION;
COFIRED CERAMIC SUBSTRATE MANUFACTURING;
HIGH DENSITY INTERCONNECT;
MULTI LAYER CERAMIC;
MULTICHIP MODULE CERAMIC;
MULTICHIP MODULES;
|
|
EID: 0034836398
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
|
Times cited : (1)
|
|
References (0)
|