Enhanced heat dissipation using flip-chip geometry in InGaN laser diodes

Journal of the Korean Physical Society

Volumn 42, Issue SPEC., 2003, Pages

  Chae, Suhee ^a   Cho, Jaehee ^a   Kwak, Joon Seop ^a   Ha, Kyoungho ^a   Nam, O H ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Flip chip; Heat transfer; InGaN; Laser diodes

Indexed keywords

EID: 0037305527     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (4)

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