Phase equilibria of the ternary Al-Cu-Ni system and interfacial reactions of related systems at 800°C

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 34, Issue 2, 2003, Pages 199-209

  Wang, Chao Hong ^a   Chen, Sinn Wenn ^a   Chang, Chia Hua ^b   Wu, Jen Chin ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; ANNEALING; DIFFUSION IN SOLIDS; PHASE EQUILIBRIA; SOLID SOLUTIONS; SOLUBILITY; THERMAL EFFECTS; X RAY DIFFRACTION ANALYSIS;

ALUMINUM COPPER NICKEL ALLOYS; ELECTRON PROBE MICROANALYSIS; INTERFACIAL REACTIONS; ISOTHERMAL SECTION;

TERNARY SYSTEMS;

EID: 0037304913     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-003-0322-7     Document Type: Article

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