Three-dimensional micro-optical switching system architecture using slab-waveguide-based micro-optical switches

Optical Engineering

Volumn 42, Issue 2, 2003, Pages 439-446

  Yoshimura, Tetsuzo ^a   Tsukada, Satoshi ^a   Kawakami, Shinji ^a   Ninomiya, Minoru ^a   Arai, Yukihiko ^a   Kurokawa, Hiroaki ^a   Asama, Kunihiko ^a  

^a TOKYO UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Optical switch; Optical z connection, scalable film optical link multichip module; Optoelectronic printed circuit board; Photolithographic packaging; Three dimensional optical switching system; Waveguide prism deflector

Indexed keywords

FINITE DIFFERENCE METHOD; OPTICAL INTERCONNECTS; OPTICAL SYSTEMS; OPTICAL WAVEGUIDES; OPTOELECTRONIC DEVICES; PRINTED CIRCUIT BOARDS; PRISMS; TIME DOMAIN ANALYSIS;

OPTICAL WIRING;

OPTICAL SWITCHES;

EID: 0037303801     PISSN: 00913286     EISSN: None     Source Type: Journal    
DOI: 10.1117/1.1532333     Document Type: Article

References (19)

1. M. W. Haney and M. P. Christensen, "Sliding Banyan network," J. Lightwave Technol. 14, 703-710 (1996).
2. T. Yoshimura, S. Tsukada, S. Kawakami, Y. Arai, H. Kurokawa, and K. Asama, "3D micro optical switching system (3D-MOSS)-packaging design," 2001 IEEE LEOS Annual Meeting Conf. Proc., pp. 499-500 (2001).
3. T. Yoshimura, J. Roman, Y. Takahashi, M. Lee, B. Chou, S. Beilin, W. Wang, and M. Inao, "Optoelectronic scalable substrates based on film/Z-connection and its application to film optical link module (FOLM)," Proc. SPIE 3952, 202-213 (2000).
4. T. Yoshimura, Y. Takahashi, M. Inao, M. Lee. W. Chou, S. Beilin, W-C. Wang, J. Roman, and T. Massingill, "Systems based on optoelectronic substrates with electrical and optical interconnections and methods for making," U.S. Patent No. 6,343,171 (2002).
5. T. Yoshimura, J. Roman, Y. Takahashi, W. V. Wang, M. Inao, T. Ishituka, K. Tsukamoto, K. Motoyoshi, and W. Sotoyama, "Self-organizing lightwave network (SOLNET) and its application to film optical circuit substrates," IEEE Trans. Comp., Packag. Technol. 24, 500-509 (2001).
6. T. Yoshimura, K. Kumai, T. Mikawa, and O. Ibaragi, "Photolithographic packaging with selectively occupied repeated transfer (PL-Pack with SORT) for scalable optical link multi-chip-module (SFOLM)," IEEE Trans. Electron. Packag. Manufacl. Technol. 25, 19-25 (2002).
7. T. Yoshimura, Japanese Disclosure, Tokukaihei 4-181231, 4-204633 (1992) (in Japanese).
8. T. Yoshimura, "Design of organic nonlinear optical materials for electro-optic and all-optical devices by computer simulation," Fujitsu Sci. Tech. J. 27, 115-131 (1991).
9. M. Nakazato and N. Suzuki. "Development of simulation program of light propagation in waveguide," Fuji-Ric J. Supercomputer Tech. 6, 21-30 (1997) (in Japanese).
10. E. Yablonovitch, T. Gmitter, J. P. Harbison, and R. Bhat, "Extreme sensitivity in the lift-off of epitaxial GaAs films," Appl. Phys. Lett. 51, 2222-2224 (1987).
11. J. J. Chang, S. Jung, M. Vrazel, K. Jung, M. Lee, M. A. Brooke, N. M. Jokerst, and S. Will, "A hybrid optically interconnected microprocessor: An InP I-MSM integrated onto a mixed signal CMOS analog optical receiver with a digital CMOS microprocessor," Proc. SPIE 4089, 708-714 (2000).
12. T. Yoshimura, "Characterization of the electro-optic effect in styrylpyridinium cyanine dye thin-film crystals by an ac modulation method," J. Appl. Phys. 62, 2028-2032 (1987).
13. K. Tada, T. Arakawa, J. Non, and T. Suzuki, "Asymmetric coupled QWs beyond 40 Gb/s," 2001 IEEE LEOS Annual Meeting Conference Proceedings, 38-39 (2001).
14. 0.6As/GaAs quantum dots," Appl. Phys. Lett. 72, 1275-1277 (1998).
15. T. Yoshimura and T. Futatsugi, "Non-linear optical device using quantum dots," U.S. Patent No. 6,294,794 (2001).
16. T. Yoshimura, "Enhancing second-order nonlinear optical properties by controlling the wave function in one-dimensional conjugated molecules," Phys. Rev. B 40, 6292-6298 (1989).
17. T. Yoshimura, W. Sotoyama, K. Moloyoshi, T. Ishitsuka, K. Tsukamoto, S. Tatsuura, H. Soda, and T. Yamamoto, "Method of producing optical waveguide system, optical device and optical coupler employing the same, optical network and optical circuit board," U.S. Patent No. 6,081,632 (2000).
18. T. Yoshimura, W. Sotoyama, T. Ishitsuka, K. Tsukamoto, S. Tatsuura, and K. Motoyoshi, "Active optical circuit sheet or active optical circuit board, active optical connector and optical MCM, process for fabricating optical waveguide, and devices obtained thereby," U.S. Patent No. 5,835,646 (1998).
19. K. Takahashi, "Research and development on ultra-high-density 3-dimensional LSI-chip-stack packaging technologies," 3rd Annual Meeting Electron. Syst. Integration Technol. Digest, pp. 43-94, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronics Technologies (ASET), Tokyo, Japan (2002).