Photolithographic packaging with selectively occupied repeated transfer (Pl-pack with SORT) for scalable film optical link multichip-module (S-FOLM)

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 1, 2002, Pages 19-25

  Yoshimura, Tetsuzo ^a,b   Kumai, Koichi ^a   Mikawa, Takashi ^a   Ibaragi, Osamu ^a   Bonkohara, Manabu ^a  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

^b TOKYO UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Cost resource saving; Device transfer; Epitaxial lift off; Film optical link multichip module (FOLM); Optoelectronic microsystem integration; Optoelectronic multichip module; Optoelectronic packaging; Photolithographic packaging (PL pack); Photolithography; Scalable; Selectively occupied repeated transfer (SORT)

Indexed keywords

BONDING; COST EFFECTIVENESS; FLIP CHIP DEVICES; MULTICHIP MODULES; OPTICAL LINKS; PHOTOLITHOGRAPHY; SUBSTRATES; THIN FILM DEVICES;

OPTOELECTRONIC MICROSYSTEM INTEGRATION;

ELECTRONICS PACKAGING;

EID: 0036293003     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.1000479     Document Type: Article

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