Mitigating power bus noise with embedded capacitance in PCB designs

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2001, Pages 496-500

  Xu, Minjia ^a   Hubing, Todd H ^a   Chen, Juan ^a,b   Drewniak, James L ^a   Van Doren, Thomas P ^a   DuBroff, Richard E ^a  

^a Architectural and Environmental Engineering   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; EMBEDDED SYSTEMS; FREQUENCIES; PERMITTIVITY; SPURIOUS SIGNAL NOISE;

POWER BUS NOISE;

PRINTED CIRCUIT DESIGN;

EID: 0035785911     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. T. H. Hubing, J. L. Drewniak, T. P. Van Doren, D. M. Hockanson, "Power bus decoupling on multilayer printed circuit boards," IEEE Trans. on EMC, vol. 37, no. 2, May 1995, pp. 155-166.
2. John Sisler, "Eliminating capacitors from multilayer PCBs", Circuit Design, Vol.8, No. 7, July 1991.
3. Embedded Decoupling Capacitance (EDC) Project - Final Report. National Center for Manufacturing Sciences, 3025 Boardwalk, Ann Arbor, Michigan 48108-3266.
4. T.H. Hubing, M. Xu, J. Chen, J.L. Drewniak, T.P. Van Doren, and R.E. DuBroff, "Printed circuit board power bus decoupling using embedded capacitance", Proc. of the 4th European Symposium on Electromagnetic Compatibility, Brugge, Belgium, September 2000, pp.639-642.
5. M. Xu, T.H. Hubing, T.P. Van Doren, J.L. Drewniak, and R.E. DuBroff, "Modeling printed circuit boards with embedded decoupling capacitance", Proc. of the 14th International Zurich Symposium on Electromagnetic Compatibility, Zurich, Switzerland, Feb. 2001.