Dry l.b. forescasting of commercial tannin adhesives-bonded particleboard by TMA bending

Holz als Roh - und Werkstoff

Volumn 59, Issue 1-2, 2001, Pages 46-

  Garnier, S ^a   Huang, Z ^a,b   Pizzi, A ^a  

^a UNIVERSITÉ DE LORRAINE   (France)

^b RESEARCH INSTITUTE OF FORESTRY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; ISOTHERMS; RESINS; SOFTWOODS; THERMOMECHANICAL TREATMENT;

BEECH WOODS;

PARTICLE BOARD;

ADHESIVES; BONDING; ISOTHERMS; PARTICLE BOARDS; ROSIN; SOFTWOODS;

EID: 0035324254     PISSN: 00183768     EISSN: None     Source Type: Trade Journal    
DOI: 10.1007/s001070050470     Document Type: Article

References (3)

1. Pizzi A (1994) Advanced Wood Adhesives Technology. Dekker, New York, pp. 141
2. Pizzi A (1997) On the correlation of some theoretical and experimental results in polycondensation resins networking. J Appl Polymer Sci 63: 603-614
3. Zhao C, Garnier S, Pizzi A (1998) Particleboard dry and wet IB forecasting by gel time and dry TMA bending in PF wood adhesives. Holz Roh- Werkstoff 56: 6, 402