Organic contamination in IC package assembly and it's impact on interfacial integrity

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 68-70

  Ganesan, Gans S ^a   Lewis, Gary L ^a   Anderson, Thomas ^a   Berg, Howard M ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANGLE MEASUREMENT; ASSEMBLY; CONTACT ANGLE; CONTAMINATION; DELAMINATION; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); SEMICONDUCTING SILICON; SURFACE CLEANING;

INTERFACIAL ADHESION; ORGANIC CONTAMINANTS; PLASTIC PACKAGES; WIRE BOND QUALITY;

ELECTRONICS PACKAGING;

EID: 0029720973     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)