High-precision low-damage grinding of polycrystalline SiC

Key Engineering Materials

Volumn 238-239, Issue , 2003, Pages 59-64

  Yin, L ^a   Vancoille, E Y J ^a   Lee, L C ^a   Liu, Y C ^a   Huang, H ^a   Ramesh, K ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Diamond tool; Ductile grinding; Low damage; Polycrystalline SiC

Indexed keywords

ATOMIC FORCE MICROSCOPY; DIAMOND CUTTING TOOLS; GRINDING (MACHINING); GRINDING MACHINES; POLYCRYSTALLINE MATERIALS; POROSITY; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; X RAY DIFFRACTION ANALYSIS;

COMPUTER NUMERICALLY CONTROLLED GRINDING MACHINE; DUCTILE GRINDING; HIGH PRECISION LOW-DAMAGE GRINDING; METAL-BOND DIAMOND TOOL; OPTICAL PROFILER;

SILICON CARBIDE;

EID: 0037282416     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/kem.238-239.59     Document Type: Article

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