Precision grinding of aspherical CVD-SiC molding die

International Journal of the Japan Society for Precision Engineering

Volumn 32, Issue 1, 1998, Pages 25-30

  Suzuki, Hirofumi ^a   Kodera, Sunao ^b   Nakasuji, Tomoaki ^b   Ohta, Tsutomu ^b   Syoji, Katsuo ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

Aspherical grinding; Ductile mode grinding; Molding die of CVD SiC; On machine measurement; Resinoid bonded diamond wheel

Indexed keywords

EID: 0342723979     PISSN: 0916782X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. H. Suzuki, S. Kodera, K. Sugimoto and T. Ohta : Development of an On-Machine Aspherical Form Measurement System, JSPE, 61, 11 (1995) 1594. [in Japanese]
2. H. SUZUKI, S. Kodera and H. Shimano : Development of Off-Axis Ellipsoidal Mirrors, IPES-7, (1993) 801.