Mechanistic study of direct copper plating using a Pd catalyst & S ligand

Plating and Surface Finishing

Volumn 90, Issue 1, 2003, Pages 50-53

  Chen, Hwei Shian ^a   Huang, Y J ^a   Wan, Chi Chao ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSIS; CHELATION; COLLOIDAL GRAPHITE; ELECTRIC CONDUCTIVITY; INFRARED SPECTROSCOPY; PALLADIUM; SULFUR; SURFACE PROPERTIES; X RAY DIFFRACTION ANALYSIS;

BRIDGING LIGANDS;

COPPER PLATING;

EID: 0037277348     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

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