A source-integrated micropump for cooling of high heat flux electronics

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2003, Pages 236-241

  Benetis, V ^a   Shooshtari, A ^a   Foroughi, P ^a   Ohadi, M M ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Electrohydrodynamic (EHD); Ion drag; Micropump

Indexed keywords

ALUMINA; COMPUTER SIMULATION; COOLING; ELECTRODES; ELECTROHYDRODYNAMICS; HEAT FLUX; HEAT TRANSFER; MICROELECTROMECHANICAL DEVICES; PHOTOLITHOGRAPHY; POWER ELECTRONICS; DIELECTRIC LIQUIDS; DRAG; ELECTRIC POTENTIAL; ELECTRONIC COOLING; FABRICATION; TESTING; THERMAL VARIABLES MEASUREMENT;

HEAT FLUX ELECTRONICS; ION DRAG MICROPUMP; MICROFABRICATION; MICROPUMP DESIGN;

PUMPS;

APPLIED VOLTAGES; ELECTRODE SPACING; ELECTRONICS COOLING; ION-DRAG MICROPUMP; MICRO PUMP; PUMP PERFORMANCE; PUMPING PERFORMANCE; THREE PARAMETERS;

EID: 0037272190     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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