GIXRD of nanoscale strain patterning in wafer bonding

Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms

Volumn 200, Issue , 2003, Pages 73-78

  Eymery, J ^a   Leroy, F ^a   Fournel, F ^a  

^a CEA GRENOBLE   (France)

Author keywords

Dislocation; Grazing incidence X ray diffraction; Lateral superlattice; Strain; Wafer bonding

Indexed keywords

DEFORMATION; DISLOCATIONS (CRYSTALS); ELASTICITY; GRAIN BOUNDARIES; SILICON WAFERS; STRAIN; SUPERLATTICES; X RAY DIFFRACTION;

WAFER BONDING;

BONDING;

EID: 0037244730     PISSN: 0168583X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-583X(02)01677-4     Document Type: Conference Paper

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