Thermal stresses in an actively cooled two-piece rail structure

IEEE Transactions on Magnetics

Volumn 39, Issue 1 I, 2003, Pages 468-471

  Satapathy, Sikhanda ^a   Persad, Chadee ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

Conductor cooling; Rail life; Resistive cladding; Thermal stress

Indexed keywords

CALCULATIONS; COOLING; ELECTRIC CONDUCTORS; ELECTROMAGNETIC FIELDS; MATHEMATICAL MODELS; NUMERICAL METHODS; TEMPERATURE DISTRIBUTION; THERMAL DIFFUSION; THERMAL EXPANSION; THERMAL GRADIENTS; THERMAL STRESS; THERMOELASTICITY;

COOLING CHANNEL LOCATION; MEDIUM CALIBER LAUNCHER; THERMAL DIFFUSION EQUATIONS;

RAIL GUNS;

EID: 0037235583     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMAG.2002.806385     Document Type: Article

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