Thermal stress in EML rail-conductor overlays

IEEE Transactions on Magnetics

Volumn 37, Issue 1 I, 2001, Pages 269-274

  Satapathy, S ^a   Persad, C ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

Conductor rail life; Electromagnetic launcher; Nonlinear diffusion equations; Residual stress; Thermal stress

Indexed keywords

ALUMINUM; ELECTRIC INSULATING MATERIALS; ENTHALPY; LIFE CYCLE; LIQUID METALS; MATHEMATICAL MODELS; NONLINEAR EQUATIONS; ONE DIMENSIONAL; RESIDUAL STRESSES; THERMAL GRADIENTS; THERMAL STRESS;

JOULE HEATING; MOLTEN ALUMINUM; RAIL CONDUCTOR OVERLAYS; RESIDUAL CURVATURE; THERMAL DIFFUSION EQUATIONS;

RAIL GUNS;

EID: 0035042345     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/20.911835     Document Type: Article

References (9)

1. Electrical and thermal effects of rail cladding
2. On the nature of the armature-rail interface: Liquid metal effects
3. Experiments to measure wear in aluminum armatures
4. Characterization of hypervelocity gouge craters in rail conductors
5. Experiments to measure gouging threshold velocity for various metals against copper
6. Simulation of railgun gouging