High frequency DC:DC power conversion: The influence of package parasitics

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 2, Issue , 2003, Pages 699-704

  Pavier, Mark ^a   Sawle, Andrew ^a   Woodworth, Arthur ^a   Monteiro, Ralph ^b   Chiu, Jason ^b   Blake, Carl ^b  

^a International Rectifier   (United Kingdom)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRIC RESISTANCE; MOSFET DEVICES; POWER ELECTRONICS;

PACKAGE PARASITICS;

POWER CONVERTERS;

EID: 0037233206     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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