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Volumn 522, Issue 1-3, 2003, Pages 143-160
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Thermal roughening restrained by bulk chemical order: Cu-Pd(17%)( 1 1 5 ) versus Cu( 1 1 5 ) and Cu3Au( 1 1 12 ) surfaces
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Author keywords
Alloys; Copper; Gold; Palladium; Scanning tunneling microscopy; Step formation and bunching; Stepped single crystal surfaces; Surface roughening; Surface structure, morphology, roughness, and topography; X ray scattering, diffraction, and reflection
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Indexed keywords
CRYSTAL STRUCTURE;
MORPHOLOGY;
SCANNING TUNNELING MICROSCOPY;
SINGLE CRYSTALS;
SUPERCONDUCTING TRANSITION TEMPERATURE;
SURFACE REACTIONS;
SURFACE ROUGHNESS;
X RAY DIFFRACTION ANALYSIS;
X RAY SCATTERING;
THERMAL ROUGHENING;
COPPER ALLOYS;
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EID: 0037211731
PISSN: 00396028
EISSN: None
Source Type: Journal
DOI: 10.1016/S0039-6028(02)02341-5 Document Type: Article |
Times cited : (9)
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References (28)
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